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lp62e16128a - t series 128k x 16 bit low voltage cmos sram (august, 2001, version 1.0) 1 amic technology, inc. features n operating voltage: 1. 8 v to 2.2v n access times: 70 ns (max.) n current: very low power version: operating: 25ma (max.) standby: 10 m a (max.) n full static operation, no clock or refreshing required n all inputs and outputs are directly tt l - compatible n common i/o using three - state output n data retention voltage: 1.2v (min.) n available in 44 - pin tsop and 48 - ball csp (6 x 8mm) packages general description the lp62e16128a - t is a low operating current 2,097,152 - bit static random access mem ory organized as 131,072 words by 16 bits and operates on low power voltage from 1. 8 v to 2.2v. it is built using amic's high performance cmos process. inputs and three - state outputs are ttl compatible and allow for direct interfacing with common system bus structures. the chip enable input is provided for power - down, device enable. two byte enable inputs and an output enable input are included for easy interfacing. data retention is guaranteed at a power supply voltage as low as 1.2v. pin configurations n n tsop n n csp (chip size package) 48 - pin top view i/o 9 i/o 10 gnd vcc i/o 15 i/o 16 nc a8 nc a9 a12 a10 a11 nc a13 a14 a15 i/o 8 i/o 7 i/o 3 i/o 1 gnd vcc a0 a3 a5 a6 a4 a1 a2 nc 6 5 4 3 2 1 a b c d e f g h i/o 14 i/o 13 i/o 12 i/o 11 nc nc a7 a16 i/o 2 i/o 4 i/o 5 i/o 6 lb hb we oe ce 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 a3 a2 a1 a0 ce i/o 1 i/o 2 i/o 3 i/o 4 vcc gnd i/o 5 i/o 6 i/o 7 i/o 8 we a16 a15 a14 a13 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 a11 a10 a9 a8 nc i/o 9 i/o 10 i/o 11 i/o 12 vcc gnd i/o 13 i/o 14 i/o 15 i/o 16 lb hb oe a7 a6 lp62e16128av-t a12 a5 a4 nc
lp62e 16128a - t series (august, 2001, version 1.0) 2 amic technology, inc. block diagram decoder 1024 x 2048 memory array column i/o input data circuit control circuit vcc gnd i/o 8 i/o 1 a16 a15 a0 we hb input data circuit i/o 9 i/o 16 lb oe ce pin descriptions -- tsop pin no. symbol description 1 - 5, 18 - 22, 24 ? 27, 42 - 44 a0 - a16 address inputs 6 ce chip enable input 7 - 10, 13 - 16, 29 - 32, 35 - 38 i/o 1 - i/o 16 data inputs/outputs 17 we write enable input 39 lb lower byte enable input (i/o 1 to i/o 8 ) 40 hb higher byte enab le input (i/o 9 to i/o 16 ) 41 oe output enable input 11, 33 vcc power 12, 34 gnd ground 23, 28 nc no connection
lp62e 16128a - t series (august, 2001, version 1.0) 3 amic technology, inc. pin description - csp symbol description symbol description a0 - a16 address inputs hb higher by te enable input (i/o 9 - i/o 16 ) ce chip enable oe output enable i/o 1 - i/o 16 data input/output vcc power supply we write enable input gnd ground lb lower byte enable in put (i/o 1 - i/o 8 ) nc no connection recommended dc operating conditions (t a = - 25 c to + 85 c) symbol parameter min. typ. max. unit vcc supply voltage 1. 8 2 2.2 v gnd ground 0 0 0 v v ih input high voltage 1.4 - vcc + 0.2 v v il input low voltage - 0.2 - +0.4 v c l output load - - 30 pf ttl output load - - 1 -
lp62e 16128a - t series (august, 2001, version 1.0) 4 amic technology, inc. absolute maximum ratings* vcc to gnd ................................ ............... - 0.5v to +3.0v in, in/out volt to gnd .................... - 0.5v to vcc + 0.5v operating temperature, topr .................... - 25 c to +85 c storage temperature, tstg ...................... - 55 c to +125 c power diss ipation, p t ................................ ............... 0.7w *comments stresses above those listed under "absolute maximum ratings" may cause permanent damage to this device. these are stress ratings only. functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. exposure to the absolute maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics (t a = - 25 c to + 85 c, vcc = 1. 8 v to 2.2v , gnd = 0v) symbol parameter lp62e16128a - 70llt unit conditions min. max. ? i li ? input leakage current - 1 m a v in = gnd to vcc ? i lo ? output leakage current - 1 m a ce = v ih or lb = v ih or hb = v ih or oe = v ih or we = v ih v i/o = gnd to vcc i cc active power supply current - 5 ma ce = v il , i i/o = 0ma i cc1 dynamic operating - 25 ma min. cycle, duty = 100% ce = v il , i i/o = 0ma i cc2 current - 10 ma ce = v il , v ih = vcc, v il = 0v, f = 1m hz, i i/o = 0 ma i sb - 0.3 ma ce = v ih i sb1 standby power - 10 m a ce 3 vcc ? 0.2v, v in 3 0v v ol output low voltage - 0.2 v i ol = 0.1 ma v oh output high voltage 1.6 - v i oh = - 0.1 ma
lp62e 16128a - t series (august, 2001, version 1.0) 5 amic technology, inc. truth table ce oe we lb hb i/o 1 to i/o 8 mode i/o 9 to i/o 16 mode vcc current h x x x x not selected not selected i sb1 , i sb x x x h h high - z high - z i sb1 , i sb l l read read i cc1 , i cc2 , i cc l l h l h read high - z i cc1 , i cc2 , i cc h l high - z read i cc 1 , i cc2 , i cc l l write write i cc1 , i cc2 , i cc l x l l h write not write/hi - z i cc1 , i cc2 , i cc h l no write/hi - z write i cc1 , i cc2 , i cc l h h x l high - z high - z i cc1 , i cc2 , i cc l x high - z high - z i cc1 , i cc2 , i cc note: x = h or l capac itance (t a = 25 c, f = 1.0mhz) symbol parameter min. max. unit conditions c in * input capacitance 6 pf v in = 0v c i/o * input/output capacitance 8 pf v i/o = 0v * these parameters are sampled and not 100% tested.
lp62e 16128a - t series (august, 2001, version 1.0) 6 amic technology, inc. ac characteristics (t a = - 25 c to +85 c , vcc = 1. 8 v to 2.2v) lp62e16128a - 70llt unit symbol parameter min. max. read cycle t rc read cycle time 70 - ns t aa address access time - 70 ns t ace chip enable access time - 70 ns t be byte enable access time - 70 t oe output enable to output vali d - 35 ns t clz chip enable to output in low z 10 - ns t blz byte enable to outupt in low z 10 - ns t olz output enable to output in low z 5 - ns t chz chip disable to output in high z - 25 ns t bhz byte disable to output in high z - 25 ns t ohz output dis able to output in high z - 25 ns t oh output hold from address change 5 - ns write cycle t wc write cycle time 70 - ns t cw chip enable to end of write 60 - ns t bw byte enable to end of write 60 - ns t as address setup time 0 - ns t aw address valid to e nd of write 60 - ns t wp write pulse width 55 - ns t wr write recovery time 0 - ns t whz write to output in high z - 25 ns t dw data to write time overlap 30 - ns t dh data hold from write time 0 - ns t ow output active from end of write 5 - ns note: t chz , t bhz and t ohz and t whz are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels.
lp62e 16128a - t series (august, 2001, version 1.0) 7 amic technology, inc. timing waveforms read cycle 1 (1, 2, 4) t rc t oh t aa t oh address d out read cycle 2 (1, 2, 3) t rc t aa address t ace t chz 5 ce hb, lb t bhz 5 oe t clz 5 t be t blz 5 t oe t olz 5 t ohz 5 d out notes: 1. we is high for read cycle. 2. device is continuously enabled ce = v il , hb = v ih and, or lb = v il . 3. address valid prior to or coinciden t with ce and ( hb and, or lb ) transition low. 4. oe = v il . 5. transition is measured 500mv from steady state. this parameter is sampled and not 100% tested.
lp62e 16128a - t series (august, 2001, version 1.0) 8 amic technology, inc. timing wa veforms (continued) write cycle 1 (write enable controlled) t wc t aw address data in data out we hb, lb ce t wr 3 t cw t bw t as 1 t wp 2 t dw t dh t ow t whz 4
lp62e 16128a - t series (august, 2001, version 1.0) 9 amic technology, inc. timing waveforms (continued) write cycle 2 (chip enable controlled) t wc t aw address data in data out we hb, lb ce t wr 3 t cw 2 t bw t as 1 t wp t dw t dh t ow t whz 4
lp62e 16128a - t series (august, 2001, version 1.0) 10 amic technology, inc. timing waveforms (continued) write cycle 3 (byte enable co ntrolled) t wc t aw address data in data out we hb, lb ce t wr 3 t cw t bw 2 t as 1 t wp t dw t dh t ow t whz 4 notes: 1. t as is measured from the address valid to the beginning of write. 2. a write occurs during the overlap (t wp , t bw ) of a low ce , we and ( hb an d , or lb ). 3. t wr is measured from the earliest of ce or we or ( hb and , or lb ) going high to the end of the write cycle. 4. oe level is high or low. 5. transition is measured 500mv from steady state. this parameter is sampled and not 100% tested.
lp62e 16128a - t series (august, 2001, version 1.0) 11 amic technology, inc. ac test conditions input pulse levels 0.2v to vcc - 0.2v input rise and fall time 5 ns input and output timing reference levels 0.9v output load see figures 1 and 2 30pf * including scope and jig. * including scope and jig. c l ttl 5pf c l ttl figure 1. output load figure 2. output load for t clz , t olz , t chz , t ohz , t whz , and t ow data retention characteristics (t a = - 25 c to 85 c) symbol parameter min. max. unit condition s v dr vcc for data retention 1.2 2.2 v ce 3 vcc - 0.2v i ccdr data retention current - 3* m a vcc = 1.2 v, ce 3 vcc - 0.2v v in 3 0v t cdr chip disable to data retention time 0 - ns t r operation recovery time t rc - ns see retention waveform t vr vcc rising time from data retention voltage to operating voltage 5 - ms * lp62e16128a - 70llt i ccdr : max. 1 m a at t a = 0 c to + 40 c
lp62e 16128a - t series (august, 2001, version 1.0) 12 amic technology, inc. low vcc data retention waveform vcc ce t cdr v ih 1.8v t r v ih 1.8v data retention mode v dr 3 1.2v ce 3 v dr - 0.2v t vr ordering information part no. access time (ns) operating current max. (ma) standby current max. ( m m a) package lp62e16128av - 70llt 2 5 10 44l tsop lp62e16128au - 70llt 70 25 10 48l csp
lp62e 16128a - t series (august, 2001, version 1.0) 13 amic technology, inc. package information tsop 44l type ii outline dimensions unit: inches/mm 44 1 d e h e 0.254 l 1 l a 1 a 2 a s b e d y l 1 c l 23 22 symbol dimension in inch dimension in mm min. nom. max. min. nom. max. a - - 0.047 - - 1.20 a 1 0.002 - - 0.05 - - a 2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.010 0.014 0.018 0.25 0.35 0.45 c - 0.006 - - 0.15 - d 0.721 0.725 0.729 18.31 18.41 18.51 e 0.396 0.400 0.404 10. 06 10.16 10.26 e - 0.031 - - 0.80 - h e 0.455 0.463 0.471 11.56 11.76 11.96 l 0.016 0.020 0.024 0.40 0.50 0.60 l 1 - 0.031 - - 0.80 - s - - 0.036 - - 0.93 y - - 0.004 - - 0.10 q 0 - 5 0 - 5 notes: 1. dimension d&e do not include interlead flash. 2. dimension b does not include dambar protrusion/intrusion. 3. dimension s includes end flash.
lp62e 16128a - t series (august, 2001, version 1.0) 14 amic technology, inc. package information 48ld csp ( 6 x 8 mm ) outline dimensions unit: mm (48tfbga) a 1 a 2 a b c d e f g h top view ball#a1 corner side view c seating plane // 0.25 c a (0.36) a b c d e f g h 1 2 3 4 5 6 1 2 3 4 5 6 c 0.10 c s 0.25 s a b b (48x) bottom view ball*a1 corner e e 1 e b e d 1 d a 0.20(4x) 0.10 c dimensions in mm symbol min. nom. max. a 1.04 1.14 1.24 a 1 0.20 0.25 0.30 a 2 0.48 0.53 0.58 d 5.90 6.00 6.10 e 7.90 8.00 8.10 d 1 --- 3.75 --- e 1 --- 5.25 --- e --- 0.75 --- b 0.30 0.35 0.40 note: 1. the ball diameter, ball pitch, stand - off & package thickness are different from jedec spec mo192 (low profile b ga family). 2. primary datum c and seating plane are defined by the spherical crowns of the solder balls. 3. dimension b is measured at the maximum. there shall be a minimum clearance of 0.25mm between the edge of the solder ball and the body edge.

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